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 CM1405 LCD EMI Filter Array with ESD Protection
Features
* * * * * Eight channels of EMI filtering 30kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) 30kV ESD protection on each channel (HBM) Better than 35dB of attenuation at 800-2700MHz Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 20-bump, 4.000mm x 1.458mm footprint Chip Scale Package OptiGuardTM coated version available for improved reliability at assembly Lead-free version available
Product Description
California Micro Device's CM1405 is an EMI filter array with ESD protection, which integrates eight Pi- filters (C-R-C). The CM1405 has component values of 25pF100-25pF. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of 30kV, exceeding the maximum requirement of the IEC61000-4-2 international standard. Using the MILSTD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than 30kV. This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy-touse pin assignments. In particular, the CM1405 is ideal for EMI filtering and protecting data lines from ESD for the LCD display in mobile handsets. The CM1405-03 incorporates OptiGuardTM coating which results in improved reliability at assembly and is available in space-saving, low-profile chip-scale packages with optional lead-free finishing.
* * *
Applications
* * * * * * * LCD data lines in mobile handsets EMI filtering & ESD protection for high-speed I/O ports EMI filtering for high-speed data lines Wireless handsets Cell phones Notebook computers PDAs / Handheld PCs
Electrical Schematic
100 FILTERn* 25pF 25pF FILTERn*
GND (Pins B1-Bn)
1 of 8 EMI Filtering + ESD Channels
* See Package/Pinout Diagram for expanded pin information.
(c) 2004 California Micro Devices Corp. All rights reserved. 06/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
1
CM1405
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
Orientation Marking (see note 2)
BOTTOM VIEW
(Bumps Up View)
8
FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8
(Bumps Down View)
1 A B C 2 3 4 5 6 7
C1 C2
GND
C3
GND
C4 B2
C5
GND
C6 B3
C7
GND
C8 B4
N051
B1 Orientation Marking
FILTER1 FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
A1
A1
A2
A3
A4
A5
A6
A7
A8
CM1405-01 Chip Scale Package
Orientation Marking (see note 2)
1 A B C
2
3
4
5
6
7
8
FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8
C1
GND
C2 B1
C3
GND
C4 B2
C5
GND
C6 B3
C7
GND
C8 B4
N053
Orientation Marking
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
A1
A1
A2
A3
A4
A5
A6
A7
A8
Notes: Chip Scale Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
CM1405-03
PIN DESCRIPTIONS
PIN(s) A1 A2 A3 A4 A5 A6 A7 A8 B1-B4 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 GND DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Filter Channel 7 Filter Channel 8 Device Ground PIN(s) C1 C2 C3 C4 C5 C6 C7 C8 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Filter Channel 7 Filter Channel 8
Ordering Information
PART NUMBERING INFORMATION
Standard Finish No Coating Ordering Part Bumps 20 PKG CSP Number1 CM1405-01CS Part Marking N051 OptiguardTM Coated Ordering Part Number1 CM1405-03CS Part Marking N053 Lead-free Finish2 No Coating Ordering Part Number1 CM1405-01CP Part Marking N051 OptiguardTM Coated Ordering Part Number1 CM1405-03CP Part Marking N053
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
(c) 2004 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
06/16/04
CM1405
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 500 UNITS C mW mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL R C VDIODE ILEAK VSIG PARAMETER Resistance Capacitance Diode Standoff Voltage Diode Leakage Current (reverse bias) Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off Frequency ZSOURCE=50 ZLOAD=50 , At 2.5V DC, 1MHz, 30mV AC IDIODE = 10A VDIODE = 3.3V ILOAD = 10mA ILOAD = -10mA Notes 2,4 and 5 30 30 Notes 2,3,4 and 5 +12 -7 R = 100 C = 25pF , 70 MHz V V kV kV 5.6 -0.4 CONDITIONS MIN 80 20 5.5 100 6.8 -0.8 9.0 -1.5 TYP 100 25 MAX 120 30 UNITS pF V nA V V
VESD
VCL
fC
Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization.
(c) 2004 California Micro Devices Corp. All rights reserved. 06/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
3
CM1405
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. A1-C1 EMI Filter Performance
Figure 2. A2-C2 EMI Filter Performance
(c) 2004 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
06/16/04
CM1405
Performance Information (cont'd)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 3. A3-C3 EMI Filter Performance
Figure 4. A4-C4 EMI Filter Performance
(c) 2004 California Micro Devices Corp. All rights reserved. 06/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
5
CM1405
Performance Information (cont'd)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 5. A5-C5 EMI Filter Performance
Figure 6. A6-C6 EMI Filter Performance
(c) 2004 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
06/16/04
CM1405
Performance Information (cont'd)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 7. A7-C7 EMI Filter Performance
Figure 8. A8-C8 EMI Filter Performance
(c) 2004 California Micro Devices Corp. All rights reserved. 06/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
7
CM1405
Performance Information (cont'd)
Figure 9. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25C)
(c) 2004 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
06/16/04
CM1405
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125mm - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 260C
N n o e M s D fin dP d o -S ld r a k e e a 0 7m D . .2 5 m IA
S ld r S n il O e in o e te c p n g 0 3m D . .3 0 m IA
S ld r M s O e in o e ak p n g 0 2m D . .3 5 m IA
Figure 10. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (C)
200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0
Figure 11. Eutectic (SnPb) Solder Ball Reflow Profile
(c) 2004 California Micro Devices Corp. All rights reserved. 06/16/04
Figure 12. Lead-free (SnAgCu) Solder Ball Reflow Profile
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
9
CM1405
Mechanical Details
CM1405-01 Mechanical Specifications The package dimensions for the CM1405-01 are presented below.
C1
Mechanical Package Diagrams
BOTTOM VIEW
A1 B1 C A2 B A A 1 2 3 4 5 6 7 8 D1 D2 C2 B2 B4 B3
SIDE VIEW
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 20 Inches Nom Max
3.955 4.000 4.045 0.1557 0.1575 0.1593 1.413 1.458 1.503 0.0556 0.0574 0.0592 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.200 0.250 0.300 0.0079 0.0098 0.0118 0.244 0.294 0.344 0.0096 0.0116 0.0135 0.561 0.605 0.649 0.0221 0.0238 0.0255 0.355 0.380 0.405 0.0140 0.0150 0.0159 3500 pieces
0.30 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1405-01 Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
(c) 2004 California Micro Devices Corp. All rights reserved.
10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
06/16/04
CM1405
Mechanical Details (cont'd)
CM1405-03 Mechanical Specifications The package dimensions for the CM1405-03 are presented below. Mechanical Package Diagrams
BOTTOM VIEW
OptiGuardTM Coating
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 20 Inches Nom Max
A1 C1 B1 C A2 B A 1 A 2 3 4 5 6 7 8 D1 D2 C2 B2 B4 B3
3.955 4.000 4.045 0.1557 0.1575 0.1593 1.413 1.458 1.503 0.0556 0.0574 0.0592 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.200 0.250 0.300 0.0079 0.0098 0.0118 0.244 0.294 0.344 0.0096 0.0116 0.0135 0.600 0.670 0.739 0.0236 0.0264 0.0291 0.394 0.445 0.495 0.0155 0.0175 0.0195 3500 pieces
0.30 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
SIDE VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1405-03 Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER CM1405 CHIP SIZE (mm) 4.00 X 1.46 X 0.6 POCKET SIZE (mm) B0 X A0 X K0 4.11 X 1.57 X 0.76 TAPE WIDTH W 12mm REEL DIAMETER 330mm (13")
10 Pitches Cumulative Tolerance On Tape 0.2 mm
QTY PER REEL 3500
P0 4mm
P1 4mm
Po Top Cover Tape
Ao W Bo
Ko
For Tape Feeder Reference Only including Draft. Concentric Around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
Figure 13. Tape and Reel Mechanical Data
(c) 2004 California Micro Devices Corp. All rights reserved. 06/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
11


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